Z2 G9 TWR/I7-13700K/16G/M2-1T/W11P/700W/333 | 8B774PA | 晶元寶 3c91採購網

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8B774PA

HP 惠普

Z2 G9 TWR/I7-13700K/16G/M2-1T/W11P/700W/333

Z2 G9 TWR/I7-13700K/16G*1 DDR5-4800(NMIC)/1TB PCIe-4x4 SSD(NMIC)/NO光碟機/SD/AX211無線+BT5.2/700W/UKUM/W11P 64/3-3-3/台灣製

定價$51,000

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產品規格

內建硬碟托架	(2) Internal 3.5" bays / (3)M.2 2280 Storage (PCIe Gen4 x4)
尺寸	H: 356mm W:169mm] D:385mm
主機外觀	直立式
外接硬碟支架	(1) External 5.25" bay (1) Internal 2.5" bay (for SSD only)
光碟機	NO光碟機
作業系統	Windows 11 Pro 64
其它	SD/USB Keyboard /USB Mouse / 3-3-3保固
重量	Starting at 6.2kg
記憶體	16GB (1x16GB) DDR5 4800 NECC NMIC(4 DIMM slots,MAX:128G)
處理器	Intel Core i7-13700K (2.1GHz P-Core base frequency, 1.5GHz E-Core base frequency, up to 4.1Ghz E-Core base frequency, up to 5.1Ghz E-Core base frequency,30MB L3 cache, 8 P-cores and 8 E-cores, 24 threads)
晶片組	Intel W680 chipset
硬碟機/轉速	SSD 1TB 2280 PCIe-44 (NMIC)1 (空間3.5"2+2.5"1+M.2 PCIe G4*3)
電源	700W wide-ranging, active Power Factor Correction, 92% Efficiency
網路介面	RJ45 *1/WLAN I AX211 Wi-Fi6 +BT 5.2 WW
彈性磁碟機	(1) Dedicated 9.5mm slim optical disk drive bay
擴充插槽	PCIe Gen5 x16/PCIe Gen3 x1 - with x4 Connector/PCIe Gen3 x4 - with x16 Connector/PCIe Gen3 x4
繪圖卡	Intel UHD Graphics 770 (無獨顯)

實際規格依原廠公告規格為準